400 Tie Points - Solderless Breadboard - High Quality
Product Code: R-1830
Availability: In Stock

Rs 65.00
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  • 400 Tie Points - Solderless Breadboard

    High Quality breadboard with power lanes and printed top face for easy prototyping.


    Specifications

    • 400 tie points
    • Blister packaging
    • 2 Power lanes, Total 100 tie points in power lanes
    • 1 Double strip, Total 300 tie points
    • Size: 8.2 x 5.5 x 0.85 cm
    • Plastic housing, metal contact clips
    • Accept wires with diameter in range 20-29 AWG
    • Max Voltage - 300V
    • Max Current - 3 to 5A
    • Perfect for Arduino shield prototyping and testing

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