400 Tie Points - Solderless Breadboard

High Quality breadboard with power lanes and printed top face for easy prototyping.

Specifications

• 400 tie points
• Blister packaging
• 2 Power lanes, Total 100 tie points in power lanes
• 1 Double strip, Total 300 tie points
• Size: 8.2 x 5.5 x 0.85 cm
• Plastic housing, metal contact clips
• Accept wires with diameter in range 20-29 AWG
• Max Voltage - 300V
• Max Current - 3 to 5A
• Perfect for Arduino shield prototyping and testing

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